Description：
The automatic PCB drilling machine adopts customized laser system design and high-resolution CCD image positioning technology. It carries out semiconductor 3D packaging laser punching, carrier board ABF film drilling, etc. And the machine has an independently-owned intellectual property rights.
Benefits：
1. High-precision platform structure design;
2. Support carrier board ABF film drilling and compatible with 8-inch and 12-inch wafer level drilling;
3. It has the E-pulse function to keep the pulse energy stable (quickly changing parameters such as energy and frequency) during highly dynamic processes;
4. Adopt the high-speed and high-precision linear motor module and full closed-loop numerical control system;
5. Support Punch; circle; spiral; Processing of scribing, etc.
Micropore high density processing
