Description：
Frontside wafer marking machine, using a high-precision positioning platform and closed-loop CNC system and equipped with high-resolution CCD positioning technique and AOI detection, marks wafer on its front side. Wafer is loaded/unloaded automatically. And the machine has a fully independently owned intellectual property.
Benefits：
1. Vision accuracy: ±20um; platform positioning repeatibility: ±10um; whole machine accuracy: ±125um;
2. Compatible with 8' and 12' wafer;
3. Support power detection and real-time calibration;
4. Laser: customized, fan cooling, modular design;
5. Each component can be customized based on actual needs, with options available as per customer demand
