Description：
Backside wafer marking machine, using a high-precision positioning platform and closed-loop CNC system and being equipped with high- resolution CCD positioning techniques and AOI detection, marks wafer on its backside. Wafer is loaded/unloaded automatically. And the machine has an independently-owned intellectual property.
Benefits：
1. Vision accuracy: ±10um; platform positioning repeatibility: ±5um; whole machine accuracy: ±50um;
2. Single head efficiency surpasses that of average duplex heads by even 50%，compatible with 8-/12-inch Foup, Cassette;
3. Equipped with wafer smoothing unit for soft wafer marking, and high-precision hardware for wafer warping≤12mm；
4. Laser: green laser; fan cooling; modular design
