Description：
Laser drilling machine features a high-precision platform structure and customized laser design, with enhanced efficiency with HBC. It uses high-resolution CCD positioning technology, high-speed and precision linear motor and closed-loop CNC system, and support drilling and scribing processes. Laser has E-plus function to keep pulse energy stable in highly dynamic process. The product has an independent intellectual property.
Benefits：
1. Compatible with 8' and 12' wafers;
2. Min hole diameter: 15um, light beam trimming is adjustable, small hole edge smooth, with no heat impact or burrs;
3. Configured with CCD pre-scanning, mark point and contour positioning functions;
4. Modular design, with each component customization on demand;
5. Other optional functions can be configured on demand
HBC high-speed optical control module
