·蒙特卡罗赌城官网(vip认证)-百度百科

Backside wafer marking machine, using a high-precision positioning platform and closed-loop CNC system and being equipped with high- resolution CCD positioning techniques and AOI detection, marks wafer on its bottomside. Wafer is loaded/unloaded automati

Frontside wafer marking machine, using a high-precision positioning platform and closed-loop CNC system and equipped with high-resolution CCD positioning technique and AOI detection, marks wafer on its front side. Wafer is loaded/unloaded automatically. A

Stealth dicing machine adopts customized wafer dicing-specific laser(Ns&Ps options), 2-dimensional platform for linear motor, closed-loop CNC system and high-resolution CCD positioning technology to perform poly beam trimming and processing.

Wafer ID marking machine using a high-precision positioning platform and closed-loop CNC system and equipped with high-resolution CCD positioning technique and AOI detection, marks wafer ID for automatic wafer loading/unloading. And the machine has a full

Wafer nondestructive dicing machine uses customized inner silicon dicing laser with both penetration rate and focus quality ensured. With high-speed air floating platform, closed-loop CNC system and high-resolution CCD positioning technology, it supports

Laser drilling machine features a high-precision platform structure and customized laser design, with enhanced efficiency with HBC. It uses high-resolution CCD positioning technology, high-speed and precision linear motor and closed-loop CNC system, and s

Slitting machine adopts a high-precision platform structure and customized laser system. It also incorporates high-resolution CCD to ensure better stability. Laser has E-plus function to keep pulse energy stable even in highly dynamic process (parameters

The strip marking machine adopts the "double galvo + double platform" design and a customized laser system, which can enhance marking efficiency and support various marking contents including Logo, DMC and character. It is compatible with different materi

LLO equipment uses advanced optical laws and LLO techniques, with excimer laser and DPSS laser schemes for different users to meet application scenarios of multiple products. It realizes selective LLO efficiently and has a high yield rate

Mass transfer equipment uses advanced optical principles and industry-leading manufacturing process, makes breakthroughs on Micro LED mass transfer technology to control the transfer accuracy within ±1um, and has an industry-leading transfer yield rate an

Wafer trimming machine takes advantage of the company's experience in laser industry and incorporate multiple laser making techiques. The use of lasers of multiple wavelength meets requirements of different scenarios and products. Fine wafer trimming is a

FPC laser drilling machine adopts high-frequency pulse laserwith self-developed HBC light control module, to achieve six-axis linkage, while improving production efficiency has high-quality drilling effect, processing energy monitoring system real-time mo

The automatic PCB drilling machine adopts customized laser system design and high-resolution CCD image positioning technology. It carries out semiconductor 3D packaging laser punching, carrier board ABF film drilling, etc. And the machine has an independe

Through continuous pancake threading, laser is used to quickly remove active materials on defined coating area on top/bottom side of pancake, accompanied with air suction dedusting to lay bare the current collector and meet tab welding requirements

Laser notching and slitting machine can provide precise electrode notching and slitting with laser technology, and the product has smaller burrs and heat impact, and higher end face quality.

Closed-loop servo tension control with low-tension precision to realize real-time measuring and monitoring of winding tension, with industry leading efficiency and accuracy

Explosion-proof valve welding machine is to weld the valve with the cell base plate and uses galvo for welding. It has a reasonable structure, easy for operation and changeover, and a low fault rate, with alarm display on HMI and ensures quality tracabli

The pole welding machine is a self-developed design based on multiple years of experience in laser welding. It is used in semi-automatic pole laser welding of new energy prismatic cells, and combined with homemade professional welding software and mains

Lid welding leak test machine is a self-developed design based on multiple years of laser welding experience and is used to test air tightness of lid welding via helium testing method.

Collector laser welding machine follows the processes of lid and cell positioning, anode laser welding, cathode laser welding, sealant, cell pairing, U-taping. The welding processes integrated in turntable helps reduce cell gripping times and cell displ

Lid laser welding machine consists of loading, laser welding and nugget trimming processes. It adopts ring spot welding process with fast welding speed and high yield rate. Marble platform driven by linear motor ensures high accuracy and stable motion.

Cathode tab cleaning & welding machine helps realize JR loading, cap supply, tab & cap laser welding, tensile test, post welding CCD inspection and NG discharge

Seal pin welding machine consists of automatic loading/unloading units, filling port laser cleaning unit and seal pin laser welding unit to realize high precision welding

OLED automatic cutting machine is the first domestic equipment with automatic OLED screen cutting inspection. It supports automated OLED cutting, Pad cut, AOI detection, automatic class classification processes, and automatic CCD and correction, code scan

OLED flexible panel cutting machine uses high-frequency and high-power UV laser to reduct cutting times and improve cutting efficiency. Meanwhile, the use of large-format telecentric field mirror ensures the same effects when the machine performs small s

With a precise movement platform, visual positioning system, automatic shaft and AOI, the automatic LCD Pol Cut machine ensures high speed automatic cutting and high-quality movement. It also realizes fast POL cutting by using "cutting on the fly" techn

LCD laser terminal short-circuit cutting machine uses high-resolution CCD positioning technology and high-speed and precision linear motor plus closed-loop CNC system. Laser has E-plus function, and can keep pulse energy stable in highly dynamic process.

Laser marking machine supports various marking contents including Logo, DMC, figures and alphabet, as well as marking/reading recheck. Laser has E-plus function to keep pulse energy stable in highly dynamic process

Color film laser etching machine is the first piece in China which can process different shapes simultaneously with multi galvos, and perform laser insulation cutting for different baseboard sizes and zones. It has a rich cutting shapes accomodating strai

Laser repair machine uses linear objective switch-over system and has point defect locator, line defect locator(LDL) and recording functions. It can take and save photos of defect repair during repair process, recording information such as ID, repair pers

Perovskite laser marking equipment covers 1200mm*2400mm product laser scribbing, with independent spectroscopic system, 24-channel beam simultaneous processing technology, using high-speed and precise air flotation platform, high-resolution CCD image posi

TOPConSE laser doping machine adopts independent research and development of special laser, using laser pulse shaping technology to the formation of square homogenized spot, with high-precision digital galvanometer, after patterning can achieve perfect ov